Microwave Plasma Cleaning Machine – High-Precision Surface Treatment Equipment

Model: PM-100AE
Specifications: Chassis dimensions: 440 (W) × 600 (D) × 177 (H) mm
Weight: 11 kg

Model: PM-100AE

Specifications: Chassis dimensions: 440 (W) × 600 (D) × 177 (H) mm

Weight: 11 kg

Input voltage: AC 220V (±10%), 50 Hz

Output gas pressure: 0.2–0.9 MPa

Alarm signals: Overheat, no gas, reverse flow alarm

Microwave frequency: 2400–2500 MHz

Microwave power: 0–300 W (compressed air)

Output gas flow rate: 0–7 L/min (adjustable)

Jet head dimensions: 111 (W) × 58 (D) × 59 (H) mm

Connection method: Coaxial cable connection

Processing width: 2–6 mm

Cleaning distance: 5–20 mm

Processing speed: 0–40 m/min

Nozzle outlet flame temperature: <50°C ℃

Applications: Full range of polymer materials, metals, ceramics, silicon materials, and glass; surface cleaning of integrated circuits (low-temperature precision treatment).

Technical Advantages

Utilizes microwave-excited plasma jets; features high active particle density and delivers strong, stable cleaning/activation results.

Ultra-low temperature (near-ambient) processing; causes no temperature rise or material damage, making it ideal for heat-sensitive materials such as thin films, PET, PP, and plastics.

Operates at atmospheric pressure; ready for immediate use without a vacuum chamber, resulting in low installation and operating costs.

Uniform and gentle plasma jet; free from electric shocks or arcing, ensuring consistent treatment without damaging precision components.

High energy coupling efficiency, low power consumption, stable operation, and long service life.

Adjustable process parameters; suitable for surface treatment of various materials and precision workpieces.

Purely physical dry process using air or nitrogen as the medium; environmentally safe with no chemical pollution or residue.

Supports both handheld and fixed-mount configurations; flexibly adapts to laboratory settings, production lines, and localized spot-treatment scenarios.

Solutions

Provides ultra-low temperature plasma activation and cleaning solutions for heat-sensitive materials, thin films, soft polymers, and precision electronics.

Eliminates scrap issues caused by deformation, shrinkage, yellowing, or aging in temperature-sensitive materials due to high heat.

Enhances adhesion for bonding, dispensing, spraying, and printing processes; improves interfacial bonding strength.

Suitable for low-temperature treatment applications involving precision electronics, sensors, medical consumables, optical components, and polymer films.

Offers microwave plasma treatment solutions for laboratory R&D, small-batch sampling, and continuous online production.

Replaces traditional high-temperature corona or flame treatments, enabling safe, stable, and high-quality pretreatment for heat-sensitive materials.

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