Large-Chamber Plasma Cleaning Equipment | Surface Activation for Automotive, Electronic, and Medical Components

External dimensions (W × H × D): 800 × 1600 × 1700 mm
Internal chamber volume: 20–200 L
Electrode and chamber materials: Magnesium-aluminum alloy / SUS304

Model: C-XSM (Medium-sized)
Equipment Specifications
– Dimensions (W × H × D): 800 × 1600 × 1700 mm
– Chamber Volume: 20–200 L
– Electrode and Chamber Materials: Mg-Al Alloy / SUS304
– Electrode Configuration: Horizontal / Vertical
– Plasma Output Power: 0–10 kW (adjustable)
– Operating Frequency (Plasma Generation): 40 kHz / 13.56 MHz
– Gas Inlet/Outlet Lines: 2 inlets + 1 vent
– Gas Flow Rate: 0–1000 mL/min (automatically adjustable)
– Chamber Temperature Sensing: 0–100°C
– Cooling Method: Air cooling / Water cooling
– Discharge Vacuum Level: 30–500 mTorr
– Process Gases: Air / O₂ / N₂ / H₂ / CF₄ / Ar / Inert gases

 

Technical Advantages

– Medium-sized chamber design balances batch processing efficiency with space utilization, making it suitable for large-scale mass production.

– Uniform plasma coverage in a vacuum environment ensures consistent processing with no dead zones or untreated areas.

– Compatible with multi-layer trays and rotating racks to maximize chamber utilization and hourly throughput.

– Stable and adjustable process parameters accommodate a wide range of materials, including metals, ceramics, plastics, and glass.

– Reliable operation and low failure rates ensure the equipment can handle continuous, long-term production line workloads.

– Air/water cooling design enhances equipment durability and simplifies maintenance.

– Purely physical dry cleaning process eliminates the need for chemical agents; it is eco-friendly, leaves no residue, and meets production safety standards.

– Supports automated loading and unloading, facilitating seamless integration into overall workshop production workflows.

 

Solutions

– Provides batch vacuum plasma cleaning and activation solutions for electronic components, connectors, sensors, and more.

– Resolves issues with poor adhesion, dispensing, and sealing caused by surface contaminants such as oils, mold release agents, and organic residues.

– Suitable for large-scale surface modification of automotive parts, hardware components, and plastic parts.

– Enhances surface adhesion and interfacial bonding strength prior to processes such as coating, printing, welding, and bonding.

– Offers cost-effective, mass-production-ready plasma surface treatment solutions tailored for small and medium-sized enterprises.

– Meets the demands of high-volume production requiring consistent quality and high yields, thereby reducing defect rates and rework costs.

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