Model: C-XSM (Medium-sized)
Equipment Specifications
– Dimensions (W × H × D): 800 × 1600 × 1700 mm
– Chamber Volume: 20–200 L
– Electrode and Chamber Materials: Mg-Al Alloy / SUS304
– Electrode Configuration: Horizontal / Vertical
– Plasma Output Power: 0–10 kW (adjustable)
– Operating Frequency (Plasma Generation): 40 kHz / 13.56 MHz
– Gas Inlet/Outlet Lines: 2 inlets + 1 vent
– Gas Flow Rate: 0–1000 mL/min (automatically adjustable)
– Chamber Temperature Sensing: 0–100°C
– Cooling Method: Air cooling / Water cooling
– Discharge Vacuum Level: 30–500 mTorr
– Process Gases: Air / O₂ / N₂ / H₂ / CF₄ / Ar / Inert gases
Technical Advantages
– Medium-sized chamber design balances batch processing efficiency with space utilization, making it suitable for large-scale mass production.
– Uniform plasma coverage in a vacuum environment ensures consistent processing with no dead zones or untreated areas.
– Compatible with multi-layer trays and rotating racks to maximize chamber utilization and hourly throughput.
– Stable and adjustable process parameters accommodate a wide range of materials, including metals, ceramics, plastics, and glass.
– Reliable operation and low failure rates ensure the equipment can handle continuous, long-term production line workloads.
– Air/water cooling design enhances equipment durability and simplifies maintenance.
– Purely physical dry cleaning process eliminates the need for chemical agents; it is eco-friendly, leaves no residue, and meets production safety standards.
– Supports automated loading and unloading, facilitating seamless integration into overall workshop production workflows.
Solutions
– Provides batch vacuum plasma cleaning and activation solutions for electronic components, connectors, sensors, and more.
– Resolves issues with poor adhesion, dispensing, and sealing caused by surface contaminants such as oils, mold release agents, and organic residues.
– Suitable for large-scale surface modification of automotive parts, hardware components, and plastic parts.
– Enhances surface adhesion and interfacial bonding strength prior to processes such as coating, printing, welding, and bonding.
– Offers cost-effective, mass-production-ready plasma surface treatment solutions tailored for small and medium-sized enterprises.
– Meets the demands of high-volume production requiring consistent quality and high yields, thereby reducing defect rates and rework costs.


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